K4B1G0446E Datasheet, PDF (12/23 Pages) Samsung semiconductor – DDR3 SDRAM Memory

Product Guide
6. Package Dimension
May. 2010
DDR3 SDRAM Memory
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
(Datum A)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
0.80 1.60
3.20
#A1
987654321
B
A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
(0.95)
(1.90)
MOLDING AREA
Bottom
7.50 ± 0.10
Top
0.35 ± 0.05
1.10 ± 0.10
96Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6.40
0.80 1.60
3.20
#A1 INDEX MARK
987654321
#A1
B
A
(Datum A)
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
(0.95)
(1.90)
MOLDING AREA
Bottom
7.50 ± 0.10
Top
0.35 ± 0.05
1.10 ± 0.10
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