K4S640832K_07 Datasheet, PDF (4/8 Pages) Samsung semiconductor – SDRAM Product Guide

General Information
SDRAM
C. Industrial Temperature SDRAM Component Product Guide
Density
64Mb
K-die
64Mb
N-die
128Mb
I-die
128Mb
K-die
256Mb
H-die
256Mb
J-die
Bank
Part Number
4Banks _KS641632K
4Banks KS641632N
4Banks K4S281632I
4Banks K4S281632K
4Banks K4S561632H
4Banks K4S561632J
Package^*1 & Power^*2
& Speed^*3
UI60/I75
UP60/P75
LI60/I75
LP60/P75
UI60/I75
UP60/P75
U^*4I60/I75
UP60/P75
UI60/I75
UP60/P75
U^*4I60/I75
UP60/P75
Org.
Interface Refresh Power (V)
4M x 16
4M x 16
8M x 16
LVTTL
LVTTL
LVTTL
4K/64ms 3.3 ± 0.3V
4K/64ms 3.3 ± 0.3V
4K/64ms 3.3 ± 0.3V
8M x 16
LVTTL 4K/64ms 3.3 ± 0.3V
16M x 16
LVTTL 8K/64ms 3.3 ± 0.3V
16M x 16
LVTTL 8K/64ms 3.3 ± 0.3V
Package
Lead-free 54pin TSOP(II)
Lead-free & Halogen-free
54pin TSOP(II)
Lead-free 54pin TSOP(II)
Lead-free & Halogen-free
54pin TSOP(II)^*4
Lead-free 54pin TSOP(II)
Lead-free & Halogen-free
54pin TSOP(II)^*4
Avail.
EOL
DEC.’08
1Q’08
EOL
AUG.’08
Now
EOL
SEP.’08
Now
Note 1 :
U : TSOP(II) (Lead-free)
L : TSOP(II) (Lead-free & Halogen-free)
Note 2 :
Temperature and Power Description
I
Industrial Temperature, Normal Power
P
Industrial Temperature, Low Power
- Industrial Temp (-40°C < Ta < 85°C)
Note 3 :
Speed
75
60
50
Description
7.5ns, PC133 (133Mhz @ CL=3)
6.0 ns (166Mhz @ CL=3)
5.0 ns (200Mhz @ CL=3)
Note 4 : 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
November 2007