K4S640832K_07 Datasheet, PDF (2/8 Pages) Samsung semiconductor – SDRAM Product Guide

General Information
A. SDRAM Component Ordering Information
12 3
4
5
6 78
9 10 11
K4 SXXXXXXX-XXXX
SDRAM
SAMSUNG Memory
DRAM
Product
Density & Refresh
Organization
Speed
Temperature & Power
Package Type
Revision
Interface (VDD, VDDQ)
Bank
1. SAMSUNG Memory : K
2. DRAM : 4
3. Product
S : SDRAM
4. Density & Refresh
16 : 16Mb, 4K/64ms
64 : 64Mb, 4K/64ms
28 : 128Mb, 4K/64ms
56 : 256Mb, 8K/64ms
51 : 512Mb, 8K/64ms
5. Organization
04 : x 4
06 : x 4 Stack (Flex frame)
07 : x 8 Stack (Flex frame)
08 : x 8
16 : x16
32 : x32
6. Bank
2 : 2 Banks
3 : 4 Banks
7. Interface ( VDD, VDDQ)
2 : LVTTL (3.3V, 3.3V)
8. Revision
M : 1st Gen.
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen
H : 9th Gen
J : 11th Gen.
K : 12th Gen
N : 14th Gen
9. Package Type
T : TSOP II
U : TSOP II (Lead-free)^*1
N : sTSOP II
V : sTSOP II (Lead-free)^*1
L : TSOP II(Lead-free & Halogen-free)^*1
Note 1: All of Lead-free or Halogen-free product are in
compliance with RoHS
10. Temperature & Power
C : Commercial Temp.( 0°C ~ 70°C) & Normal Power
L : Commercial Temp.( 0°C ~ 70°C) & Low Power
I : Industrial Temp.( -40°C ~ 85°C) & Normal Power
P : Industrial Temp.( -40°C ~ 85°C) & Low Power
11. Speed (Default CL= 3)
75 : 7.5ns, PC133 (133MHz CL=3)
60 : 6.0ns (166MHz CL=3)
50 : 5.0ns (200MHz CL=3)
November 2007