BW1254X Datasheet, PDF (3/18 Pages) Samsung semiconductor – 0.35μm 14-BIT 10MSPS ADC

0.35µm 14-BIT 10MSPS ADC
CORE PIN DESCRIPTION
Name
REFTOP
REFBOT
BGR
CML
CML1
VDDA1
VBBA1
VSSA1
AINT
AINC
ITEST
STBY
CKIN
D[13:0]
ORI
VBBA2
VSSA2
VDDA2
I/O Type
AB
AB
AB
AB
AB
AP
AG
AG
AI
AI
AB
DI
DI
DO
DO
DG
DG
DP
I/O Type Abbr.
— AI: Analog Input
— DI: Digital Input
— AO: Analog Output
— DO: Digital Output
— AP: Analog Power
— AG: Analog Ground
— DP: Digital Power
— DG: Digital Ground
— AB: Analog Bidirectional
— DB: Digital Bidirectional
BW1254X
I/O Pad
piar10_bb
piar10_bb
piar10_bb
piar10_bb
piar10_bb
vdda
vbba
vssa
piar10_bb
piar10_bb
pia_bb
picc_bb
picc_bb
poa_bb
poa_bb
vbba
vssd
vddd
Pin Description
Reference Top Output/Force (2.0V)
Reference Bottom Output/Force (1.0V)
BGR output (1.23V)
Internal Bias
Internal Bias
Analog Power (3.3V)
Analog Sub Bias
Analog Ground
Analog Input +
(Input Range : 1.0V ~ 2.0V)
Analog Input -
(Input Range : 1.0V ~ 2.0V)
open=use internal bias point
VDD=power saving (standby), GND=normal
Sampling Clock Input
Digital Output
Out of Range Indicator
Digital Sub Bias
Digital GND
Digital Power (3.3V)
3