BW1254X Datasheet, PDF (11/18 Pages) Samsung semiconductor – 0.35μm 14-BIT 10MSPS ADC

0.35µm 14-BIT 10MSPS ADC
PACKAGE PIN DESCRIPTION
Pin No.
1
2
3
4
5
6, 7
8
9, 10
11
13
16
17
18
19
25
26
27
28~39
40
42
44
45, 46
47, 48
Name
BGR
REFTOP
REFBOT
CML
CML1
VDDA1
VBBA1
VSSA1
AINT
AINC
ITEST
STBY
VDDA3
VSSA3
TRIST
ORI
DO[0]
DO[1:12]
DO[13]
CKIN
VBBA2
VSSA2
VDDA2
I/O Type
AB
AB
AB
AB
AB
AP
AG
AG
AI
AI
AB
DI
PP
PG
DI
DO
DO
DO
DO
DI
DG
DG
DP
Pin Description
Reference Voltage Output
Reference Top Output/Force
Reference bottom Output/Force
Internal Bias
Internal Bias
Analog Power (3.3V)
Analog Sub Bias
Analog Ground
Analog Input +
Analog Input -
open=use internal bias circuit
VDDA=Power saving (Standby),
GNP=Normal
PAD Power (3.3V)
PAD Ground
Tri-state Buffer Input
VDD=High Impedance,
GND=Normal
Out of Range Indicator
Normal='Low'
Out of Range='High'
Digital Output (LSB)
Digital Output
Digital Output (MSB)
Sampling Clock Input
Digital Sub Bias
Digital GND
Digital Power (3.3V)
NOTE: I/O TYPE PP and PG denote PAD Power and PAD Ground respectively.
BW1254X
11