K7D323674A Datasheet, PDF (19/19 Pages) Samsung semiconductor – 32Mb A-die DDR SRAM Specification

K7D323674A
K7D321874A
PACKAGE DIMENSIONS
153-FCBGA-14.00x22.00 LID
7.000
#A1
METAL LID
UNDERFILL
1Mx36 & 2Mx18 SRAM
∅0.300 MAX M
(Datum A)
Units:millimeters/Inches
14.000
1.27x8=10.160
5.080
987654321
A
#A1 INDEX
B
(Datum B)
0.750 MIN
12.000
14.000
TOP VIEW
UNDERFILL
0.150 MAX
1.270 BSC
153-∅0.760±0.150
BOTTOM VIEW
153 BGA PACKAGE THERMAL CHARACTERISTICS
Parameter
Symbol
Thermal Resistance
Unit
Junction to Case
θJC
0.9
°C/W
Junction to Board
θJB
6.9
°C/W
Junction to Ambient(at air flow of 1m/sec)
θJA
16.1
°C/W
Junction to Ambient(at still air)
θJA
19.5
°C/W
NOTE : 1. Junction temperature can be calculated by : TJ = TA + PD x θJA or TJ = TC + PD x θJC
2. Strongly recommends using a heat sink because it greatly improves the ambient temperature requirement
Note
- 19
Rev 1.4
Oct. 2005