K7P163666A Datasheet, PDF (14/14 Pages) Samsung semiconductor – 512Kx36 AND 1Mx18 Synchronous Pipelined SRAM

K7P163666A
K7P161866A
119 BGA PACKAGE DIMENSIONS
14.00±0.10
Indicator of
Ball(1A) Location
22.00±0.10
20.50±0.10
512Kx36 & 1Mx18 SRAM
1.27
1.27
C1.00
C0.70
0.750±0.15
0.60±0.10
12.50±0.10
1.50REF
0.60±0.10
NOTE :
1. All Dimensions are in Millimeters.
2. Solder Ball to PCB Offset : 0.10 MAX.
3. PCB to Cavity Offset : 0.10 MAX.
119 BGA PACKAGE THERMAL CHARACTERISTICS
Parameter
Junction to Ambient(at still air)
Junction to Case
Junction to Board
Symbol
Theta_JA
Theta_JC
Theta_JB
Thermal Resistance
TBD
TBD
TBD
NOTE : 1. Junction temperature can be calculated by : TJ = TA + PD x Theta_JA.
Unit
°C/W
°C/W
°C/W
Note
1W Heating
2W Heating
- 14
Sep. 2003
Rev 0.3