K4T51043QI Datasheet, PDF (13/14 Pages) Samsung semiconductor – DDR2 SDRAM Memory

Product Guide
60Ball FBGA for 1Gb F-die (x4/x8)
(Datum A)
A
(Datum B) ^B
C
D
E
F
G
H
J
K
L
7.50 ± 0.10
0.80 x 8 = 6. 40
3.20
0.80
1.60
987654321
A
# A1 INDEX MARK
B
#A1
(0.30)
MOLDING AREA
60-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
(0.60)
Bottom
84Ball FBGA for 1Gb F-die (x16)
7.50 ± 0.10
0.80 x 8 = 6. 40
3.20
A
# A1 INDEX MARK
(Datum A)
A
0.80
1.60
987654321
B
#A1
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
R
84-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
(0.30)
(0.60)
MOLDING AREA
0.2 M A B
Bottom
Apr. 2010
DDR2 SDRAM Memory
7.50 ± 0.10
Top
7.50 ± 0.10
0.37±0.05
1.10±0.10
Top
0.37±0.05
1.10±0.10
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