K7R161882B Datasheet, PDF (10/19 Pages) Samsung semiconductor – 512Kx36 & 1Mx18 & 2Mx9 QDRTM II b2 SRAM

K7R163682B
K7R161882B
K7R160982B
512Kx36 & 1Mx18 & 2Mx9 QDR^TM II b2 SRAM
ABSOLUTE MAXIMUM RATINGS*
PARAMETER
SYMBOL
RATING
UNIT
Voltage on VDD Supply Relative to VSS
VDD
-0.5 to 2.9
V
Voltage on VDDQ Supply Relative to VSS
VDDQ
-0.5 to VDD
V
Voltage on Input Pin Relative to VSS
VIN
-0.5 to VDD+0.3
V
Storage Temperature
TSTG
-65 to 150
°C
Operating Temperature
Storage Temperature Range Under Bias
TOPR
TBIAS
0 to 70
°C
-10 to 85
°C
*Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. VDDQ must not exceed VDD during normal operation.
DC ELECTRICAL CHARACTERISTICS(VDD=1.8V ±0.1V, TA=0°C to +70°C)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Input Leakage Current
IIL
VDD=Max ; VIN=VSS to VDDQ
-2
Output Leakage Current
IOL Output Disabled,
-2
Operating Current
(x36) : DDR
ICC
VDD=Max , IOUT=0mA
Cycle Time ≥ tKHKH Min
-25
-
-20
-
-16
-
Operating Current
(x18) : DDR
ICC
VDD=Max , IOUT=0mA
Cycle Time ≥ tKHKH Min
-25
-
-20
-
-16
-
Operating Current
(,x9) : DDR
ICC
VDD=Max , IOUT=0mA
Cycle Time ≥ tKHKH Min
-25
-
-20
-
-16
-
Standby Current(NOP):
DDR
Device deselected, IOUT=0mA,
ISB1 f=Max,
All Inputs≤0.2V or ≥ VDD-0.2V
-25
-20
-16
-
-
-
Output High Voltage
VOH1
VDDQ/2-0.12
Output Low Voltage
VOL1
VDDQ/2-0.12
Output High Voltage
VOH2 IOH=-1.0mA
VDDQ-0.2
Output Low Voltage
VOL2 IOL=1.0mA
VSS
Input Low Voltage
VIL
-0.3
Input High Voltage
VIH
VREF+0.1
MAX
+2
+2
600
550
500
500
450
400
480
430
380
280
260
240
VDDQ/2+0.12
VDDQ/2+0.12
VDDQ
0.2
VREF-0.1
VDDQ+0.3
UNIT NOTE
µA
µA
mA 1,5
mA 1,5
mA 1,5
mA 1,6
V
2,7
V
3,7
V
4
V
4
V
8,9
V 8,10
Notes: 1. Minimum cycle. IOUT=0mA.
2. |IOH|=(VDDQ/2)/(RQ/5)±15% for 175Ω ≤ RQ ≤ 350Ω.
3. |IOL|=(VDDQ/2)/(RQ/5)±15% for 175Ω ≤ RQ ≤ 350Ω.
4. Minimum Impedance Mode when ZQ pin is connected to VDDQ.
5. Operating current is calculated with 50% read cycles and 50% write cycles.
6. Standby Current is only after all pending read and write burst opeactions are completed.
7. Programmable Impedance Mode.
8. These are DC test criteria. DC design criteria is VREF±50mV. The AC VIH/VIL levels are defined separately for measuring timing parameters.
9. VIL (Min)DC=-0.3V, VIL (Min)AC=-1.5V(pulse width ≤ 3ns).
10. VIH (Max)DC=VDDQ+0.3, VIH (Max)AC=VDDQ+0.85V(pulse width ≤ 3ns).
- 10 -
June. 2004
Rev 3.0