TCFG_A Datasheet, PDF (9/13 Pages) Rohm – Chip tantalum capacitors (Fail-safe open structure type)

Tantalum capacitors
Malfunction rate as function of operating
temperature and rated voltage
1.0 _{Ratio = Applied Voltage}
Rated Voltage
1.0
0.5
0.3
0.2
0.7
0.1
0.5
0.06
0.03
0.02
0.3
0.01
0.1
20
40
60
85
OPERATING TEMPERATURE ( C)
Fig.3
TCFG Series A Case
Malfunction rate as function of circuit resistance (:/V)
6.0
4.0
2.0
1.0
0.8
0.6
0.4
0.1 0.2 0.4 0.6 1.0 2.0 3.0
RESISTANCE OF CIRCUIT (Ω / V)
Fig.4
(4) External temperature vs. fuse blowout
360
350
340
330
320
310
300
290
280
270
260
1
P case (2012)
A case (3216)
B case (3528)
failed
half failed
no failed
10
100
OPERATING TIME (sec)
Fig.5
(5) Power vs. fuse blowout characteristics / Product
surface temperature
100
P case (2012)
90
A case (3216)
80
B case (3528) ₃₀₀
70
open-function charcteristic
60
surface temp.
250
curve of the products
50
40
200
30
20
150
operating area
10
0
012345678
no operating area
ELECTRIC POWER (W)
9 10
Fig.6
Note: Solder the chip at 300qC or less. If it is soldered using
a temperature higher than 300qC, open function built-in may operate.
Rev.D
9/12