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BD9582F-E Datasheet, PDF (9/14 Pages) Rohm – EARTH LEAKAGE CURRENT DETECTOR IC
BD9582F,BD9582N
Datasheet
●Operational Notes
1) Absolute maximum ratings
Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely
charged to the terminal. However, it does not guarantee the circuit operation.
2) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
3) Terminal short-circuits
When the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat
generation and, subsequently, destruction.
4) Ground terminal voltage
All time, Ground terminal voltage should keep lowest voltage.
In addition, please confirm whether there is not really a terminal becoming the voltage that is lower than GND including a
transitional phenomenon.
5) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
6) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
7) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
8) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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TSZ22111・15・001
9/11
TSZ02201-0RCR1GZ00020-1-2
2012.10.26 Rev.001