BD9582F-E Datasheet, PDF (7/14 Pages) Rohm – EARTH LEAKAGE CURRENT DETECTOR IC

BD9582F,BD9582N
Datasheet
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.9(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below
θja = (Tj - Ta) / Pd ℃/W
・・・・・ (Ⅰ)
Derating curve in Fig.9(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig.10(a) show a derating curve for an example of BD9582F and BD9582N.
θja=(Tj-Ta)/P ℃/W
Ambient tempe周ra囲tu温re度 Ta [℃]
Power diss^Lip^Sa^Iのtio消n 費of電LS力I ^[W]
Pd (max)
P2
P1
θja2 < θja1
θ' ja2
θ ja2
Chip surface_チte_ッm_プp_表er_面at_温ur_度e Tj [_℃]
Power dissi^消pa^費tio^電n^力Pd^P[^[W^W]]
(a) Thermal resistance
θ' ja1 _{θ ja1}
Tj ' (max) Tj (max)
0
25
50
75
100 125 150
Ambient tem_周pe_囲ra_温tur_度e _{Ta [℃ ]}
(b) Derating curve
Figure 9. Thermal resistance and derating
1.2
1.1
1.0
BD9582N(SIP8)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
BD9582F(SOP8)
0.2
0.1
0.0
0
95
25
50
75 100 125 150
Ambient Temperature Ta [℃]
(a) BD9582F・BD9582N
Derating curve slope
UNIT
BD9582F(SOP8)
5.5
BD9582N(SIP8)
9.0
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃
BD9582F : Permissible dissipation is a value when FR4 glass epoxy board 70mm×70mm×1.6mm
(cooper foil area below 3%) is mounted.
BD9582N : Permissible dissipation is a value in the package unit.
Figure 10. Derating curve
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TSZ22111・15・001
7/11
TSZ02201-0RCR1GZ00020-1-2
2012.10.26 Rev.001