BD9885FV_09 Datasheet, PDF (4/5 Pages) Rohm – Silicon Monolithic Integrated Circuit

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〇NOTE FOR USE
１． When designing the external circuit, including adequate margins for variation between external devices and the IC.Use adequate
margins for steady state and transient characteristics.
２． Recommended Operating Range
The circuit functionality is guaranteed within of ambient temperature operation range as long as it is within recommended
operating range. The standard electrical characteristic values cannot be guaranteed at other voltages in the operating ranges,
however, the variation will be small.
３． Mounting Failures
Mounting failures, such as misdirection or miscounts, may harm the device.
４． Electromagnetic Fields
A strong electromagnetic field may cause the IC to malfunction.
５. The GND pin should be the location within ±0.3V compared with the PGND pin
６． BD9885FV has the short circuit protection with Thermal Shut Down System. When STB or Vcc pin re-supplied, They enables to
cancel the latch. If It rise the temperature of the chip more than 170℃(TYP), It make the external FET OFF
７． Absolute maximum ratings are those values that, if exceeded, may cause the life of a device to become significantly shortened.
Moreover, the exact failure mode caused by short or open is not defined. Physical countermeasures, such as a fuse, need
to be considered when using a device beyond its maximum ratings.
８． About the external FET, the parasitic Capacitor may cause the gate voltage to change, when the drain voltage is switching.
Make sure to leave adequate margin for this IC variation.
９． On operating Slow Start Control (SS is less than 2.2V), It does not operate Timer Latch.
１０． By STB voltage, BD9885FV is changed to 2 states. Therefore, do not input STB pin voltage between one state and the other
state (0.5～1.4V).
１１．The pin connected a connector need to connect to the resistor for electrical surge destruction.
１２．This IC is a monolithic IC which (as shown is Fig-1)has P⁺ substrate and between the various pins. A P-N junction is formed
from this P layer of each pin. For example, the relation between each potential is as follows,
○(When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.)
○(When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.)
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits as well as operation faults and physical damage. Accordingly you must not use methods by which
parasitic diodes operate, such as applying a voltage that is lower than the GND(P substrate)voltage to an input pin.
Resistance
(PinA)
P^＋
ï¼®
P
P^＋
N
P substrate
GND
Parasitic diode
Transistor (NPN)
(PinB)
B
C_ï¼£
E
N
GND
N
N
ï¼®
P substrate
GND
Parasitic diode
(PinB)
(PinA)
Parasitic diode
B
C
ï¼¢
ï¼£
E_ï¼¥
GND
GND
Other adjacent components _{Parasitic diode}
Fig-1 Simplified structure of a Bipolar IC
REV. B