MNA14 Datasheet, PDF (3/9 Pages) Rohm – Multi-layer ceramic chip capacitor networks

Ceramic capacitors
!Characteristics
Class 1 (For thermal compensation)
Temperature characteristics
Item
Operating temperature
Nominal capacitance (C)
Dissipation factor (tanδ)
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Resistance
to vibration
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Solderability
Appearance
Resistance
to soldering
heat
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
Withstanding voltage
Appearance
Temperature ^{Rate of capacitance change}
cycling
Dissipation factor (Tanδ)
Insulation resistance
Appearance
Rate of capacitance change
Humidity load
test
Dissipation factor (tanδ)
Insulation resistance
High-
temperature
load test
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
A (C0G)
−55°C ~ +125°C
Must be within the specified tolerance range.
100 / (400 + 20C)% or less: Less than 30 pF
0.1% or less : 30 pF or larger
10,000MΩ or 500MΩ⋅µF, whichever is smaller
The insulation must not be damaged.
Within 0 ± 30ppm / °C
No detachment or signs of detachment.
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
At least 3/4 of the surface of the two terminals
must be covered with new solder.
There must be no mechanical damage.
± 2.5% or ± 0.25 pF, whichever is larger
Must satisfy initial specified value.
10,000MΩ or 500MΩ⋅µF, whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
± 2.5% or ± 0.25 pF, whichever is larger
Must satisfy initial specified value.
10,000MΩ or 500MΩ⋅µF, whichever is smaller
There must be no mechanical damage.
± 7.5% or ± 0.75 pF, whichever is larger
0.5% or less
500MΩ or 25MΩ⋅µF, whichever is smaller
There must be no mechanical damage.
± 3.0% or ± 0.3 pF, whichever is larger
0.3% or less
10,000MΩ or 50MΩ⋅µF, whichever is smaller
MNA14
Test methods / conditions
(based on JIS C 5102)
Based on paragraph 7.8 and paragraph 9,
Measured at room temperature and standard humidity.
Measurement frequency : 1 ± 0.1MHz
Measurement voltage : 1 ± 0.1Vrms.
Based on paragraph 7.6.
Measurement is made after rated voltage is
applied for 60 ± 5s.
Based on paragraph 7.1.
Apply 300% of the rated voltage for 1 to 5s
then measure.
The temperature coefficients in table 12, paragraph
7.12 are calculated at 20°C and high temperature.
Based on paragraph 8.11.2.
Apply 5N for 10 ± 1s
in the direction
indicated by the arrow.
Pressure (5N)
Test board
Capacitor
Chip is mounted to a board in the manner
shown on the right, subjected to vibration
(type A in paragraph 8.2), and
measured 24 ± 2 hours later.
Board
Based on paragraph 8.13,
Soldering temperature : 235 ± 5°C
Soldering time
: 2 ± 0.5s
Based on paragraph 8.14.
Soldering temperature : 260 ± 5°C
Soldering time
: 5 ± 0.5s
Preheating
: 150 ± 10°C for 1 to 2 min.
Based on paragraph 9.3,
Number of cycles : 5
Capacitance measured after 24 ± 2 hrs.
Based on paragraph 9.9,
Test temperature : 40 ± 2°C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time
: 500 to 524 hrs.
Capacitance measured after 24 ± 2 hrs.
Based on paragraph 9.10,
Test temperature : Max. operating temp.
Applied voltage : rated voltage × 200%
Test time
: 1,000 to 1,048 hrs.
Capacitance measured after 24 ± 2 hrs.
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.