BD9134MUV_14 Datasheet, PDF (15/25 Pages) Rohm – Synchronous Buck Converter with Integrated FET

BD9134MUV
7. BD9134MUV Cautions on PCB Layout
Figure 34. Layout Diagram
(1) Layout the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor CO closer to the
pin PGND.
(2) Layout CITH and RITH between the pins ITH and GND as near as possible with least necessary wiring.
Note: VQFN020V4040 (BD9134MUV) has thermal PAD on the reverse of the package.
The package thermal performance may be enhanced by bonding the PAD to GND plane which occupies a large
area of PCB.
8. Recommended Components Lists on Above Application
Symbol
Part
Value
L Coil
2.0µH
2.2µH
CIN Ceramic Capacitor
22µF
CO Ceramic Capacitor
CITH Ceramic Capacitor
RITH Resistance
Cf Ceramic Capacitor
22µF
1500pF
5.1kΩ
1000 pF
Rf Resistance
10Ω
Manufacturer
Sumida
Sumida
Murata
Murata
Murata
Rohm
Murata
Rohm
Series
CDR6D28MNP-2R0NC
CDR6D26NP-2R2NC
GRM32EB11A226KE20
GRM31CB30J226KE18
GRM18 Series
MCR03 Series
GRM18 Series
MCR03 Series
Note: The parts list presented above is an example of recommended parts. Although the parts are standard, actual circuit
characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to
accommodate variations between external devices and this IC when employing the depicted circuit with other circuit
constants modified. Both static and transient characteristics should be considered in establishing these margins.
When switching noise is significant and may affect the system, a low pass filter should be inserted between the VCC
and PVCC pins, and a Schottky Barrier diode or snubber established between the SW and PGND pins.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/21
TSZ02201-0J3J0AJ00150-1-2
03.Oct.2014 Rev.002