BD3507HFV_10 Datasheet, PDF (14/16 Pages) Rohm – Nch FET Ultra LDO for PC Chipsets

BD3507HFV
●Power Dissipation
HVSOF 6
2.5
2.0
③1.70W
1.5 _②1.40W
1.0
①0.85W
0.5
0.0
0
25
50
75
100
125
150
Ambient Temperature：Ta(℃)
①:PCB 1_st layer (Cu-area : 100mm²)
θja = 147.1℃/W
②:PCB 1_st layer (Cu-area : 900mm²)
θja = 89.3℃/W
③:PCB 1_st layer (Cu-area : 2500mm²)
θja = 73.5℃/W
PCB size : 70mm×70mm×1.6mm
Technical Note
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
14/15
2010.05 - Rev.A