BD9639MWV Datasheet, PDF (1/5 Pages) Rohm – Semiconductor integrated circuit

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■ Structure
■Product
■M o d e l
Semiconductor integrated circuit
DSC/DVC system power LSI
BD9639MWV
■ Functions
(1)
6ch DC/DC converter
・CH1 Boost
FET embedded
Start-up ch,Motor
・CH2 Buck
FET embedded
Core
・CH3 Buck-Boost
FET embedded
CMOS
・CH4 Buck-Boost
FET embedded
Digital
・CH5 Buck
FET embedded
CMOS, Memory
・CH6 Boost
FET embedded
LED
(2)
Low voltage operation 2.5[V]
(3)
CH1 supply voltage output for internal circuit
(4)
CH1 PWM/PFM selectable
(5)
CH3,CH4 Boost-Buck auto switching
(6)
CH6 integrated Boost output shutdown (CH6 Load switch embedded)
(7)
Soft-start correspondence to each channel
(8)
Ground short protection（CH2～CH6）
(9)
Error amp phase compensation(CH1～CH6)
(10) Operating frequency 1.5[MHz] (CH1～CH6)
(11) Package of mounting on high heat radiation side （UQFN056V7070）
■ Absolute maximum ratings （Ta=25[℃]）
ITEM
SYMBOL
Rating
Unit
Supply voltage
VBAT
VBAT2・3・4・5・6
-0.3～7
V
SW6 permissible voltage
SW6
24.0
V
VOUT1 permissible current output
SW1 permissible current output
SW2 permissible current output
VOUT3 permissible current output
DSW3 permissible current output
USW3 permissible current output
VOUT4 permissible current output
DSW4 permissible current output
USW4 permissible current output
SW5 permissible current output
SW6 permissible current output
Power dissipation
I_VOUT1
I_SW１
I_SW2
I_VOUT3
I_DSW3
I_USW3
I_VOUT4
I_DSW４
I_USW４
I_SW5
I_SW6
Pd
1.0
A
1.0
A
2.0
A
1.0
A
1.0
A
1.0
A
1.0
A
1.0
A
1.0
A
0.5
A
0.2
A
4.83 (*1)
W
Operating temperature range
Topt
-20～+85
℃
Storage temperature range
Tstg
-55～+150
℃
Junction temperature
Tjmax
+150
℃
(*1) Implemented on Glass epoxy board （ROHM standard board：74.2×74.2×1.6[mm³] 4 layers）
Power dissipation depends on the mounted wiring pattern.
■ Operating supply voltage
ITEM
Symbol
LIMIT
Unit
MIN
TYP
MAX
VBAT
2.5
3.7
5.5
V
VBAT2
2.5
3.7
5.5
V
VBAT supply voltage
VBAT3
VBAT4
2.5
3.7
5.5
V
2.5
3.7
5.5
V
VBAT5
2.5
3.7
5.5
V
VBAT6
2.5
3.7
5.5
V
No radiation-proof design
REV. B