R1131 Datasheet, PDF (8/24 Pages) RICOH electronics devices division – R1131

R1131x
R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
TYPICAL APPLICATION
IN
C1
VDD
OUT
OUT
R1131x
Series
GND
OUT
OUT
C2
CE ⋅ CE
<External Components examples>
C2 1.0μF CM05X5R105K06AB (Kyocera)
C2 1.0μF C1005JBOJ105K (TDK)
C2 1.0μF GRM155B30J105KE18B (Murata)
Output Capacitor; 1.0μF or more capacity ceramic Type
(If VOUT < 1.0V, Tantalum Type is recommended)
Input Capacitor, 1.0μF or more capacity ceramic Type
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, be sure to use a 1.0μF or more capacitor COUT with good frequency characteristics and ESR
(Equivalent Series Resistance).
(Note: If a tantalum capacitor is connected to the Output pin for phase compensation, if the ESR value of the
capacitor is too large, the operation might be unstable. Because of this, test these ICs with as same external
components as ones to be used on the PCB.)
Chip capacitor characteristics of Bias dependence and Temperature characteristics may vary depending on its
size, manufacturer, and part number.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, pick-up the noise or unstable operation may
result. Connect a capacitor with as much as 1.0μF capacitor between VDD and GND pin as close as possible.
Set external components, especially the output capacitor, as close as possible to the ICs, and make wiring as
short as possible.
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