R1501 Datasheet, PDF (25/28 Pages) RICOH electronics devices division – Supply Current Typ. 70uA

R1501x
NO.EA-184-160801
Power Dissipation (HSOP-6J)
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The
following conditions are used in this measurement.
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Ultra-high Wattage Land Pattern
Mounting on Board
(Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic
(Four-layer Board)
76.2 mm × 114.3 mm × 0.8 mm
96%
φ 0.3 mm × 28 pcs
Standard Land Pattern
Mounting on Board
(Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic
(Double-sided Board)
50 mm × 50 mm × 1.6 mm
50%
φ 0.5 mm × 24 pcs
Measurement Result
Power Dissipation
Thermal Resistance
Ultra-high Wattage Land Pattern
2700 mW
37°C/W
(Ta = 25°C, Tjmax = 125°C)
Standard Land Pattern
Free Air
1700 mW
540 mW
59°C/W
185°C/W
3500
3250
3000
2750
3400
On Board
Ultra-high Wattage
Land Pattern
2500 2700
2250
2000
1750
1500
1250
1000
750
500
250
0
0
25
50
75
100 ¹⁰⁵ 125
150
Ambient Temperature (°C)
3500
3250
3000
2750
2500
2250 2100
2000
On Board
Standard Land Pattern
1750
1500 ₁₇₀₀
1250
1000
Free Air
750 ⁶⁷⁰
500
250 ⁵⁴⁰
0
0
25
50
75
100 ¹⁰⁵ 125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
76.2
50
50
20
The above graph shows the power dissipation of the
package at Tjmax = 125°C and Tjmax = 150°C. Operating
the device in the hatched range might have a negative
influence on its lifetime. The total hours of use and the total
years of use must be limited as follows:
Ultra-high Wattage
Standard
IC Mount Area (mm)
Measurement Board Pattern
Total Hours of Use
13,000 hours
Total Years of Use
(4 hours/day)
9 years
25