R1501 Datasheet, PDF (22/28 Pages) RICOH electronics devices division – Supply Current Typ. 70uA

R1501x
NO.EA-184-160801
PACKAGE INFORMATION
Power Dissipation (TO-252-5-P2)
Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below.
* Measurement conditions
Standard Land Pattern
Ultra High Wattage Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Through - hole
Mounting on board (Wind velocity 0m/s)
Glass cloth epoxy plastic
(Double layers)
Glass cloth epoxy plastic
(Four-layers)
50mm x 50mm x 1.6mm
76.2mm x 114.3mm x 0.8mm
Top side: Approx. 50%,
Back side: Approx. 50%
Top, Back side:50mmSquare Approx. 96%,
2nd, 3rd: 50mmSquare Approx. 100%
φ 0.5mm x 24pcs
φ 0.4mm x 30pcs
* Measurement Results
Power Dissipation
Standard Land Pattern
1900mW
(Ta=25°C, Tjmax=125°C)
Ultra High Wattage Land Pattern
3800mW
θja=(125-25°C)/1.9W= 53°C/W
Thermal Resistance
θjc= 17°C/W
θja= (125-25°C)/3.8W = 26°C/W
θjc= 7°C/W
5000 ⁴⁸⁰⁰
50
On Board
(Ultra High Wattage Land Pattern)
4000
3800
3000
2350
76.2
50
2000
1900
1000
0
0
On Board
25 50 75 100 125 150
105
Ambient Temperature (°C)
Standard
Power Dissipation
Ultra High Wattage
Measurement Board Pattern
IC Mount Area (Unit: mm)
The above graph shows the Power Dissipation of the package based on Tjmax=125°C and Tjmax=150°C.
Operating the IC in the shaded area in the graph might have an influence its lifetime. Operating time must be
within the time limit described in the table below, in case of operating in the shaded area.
Operating Time
Estimated years
(Operating four hours/day)
13,000 hours
9 years
22