R1183Z Datasheet, PDF (25/26 Pages) RICOH electronics devices division – 150mA LDO REGULATOR

PACKAGE INFORMATION
RECOMMENDED LAND PATTERN
Solder Mask
(resist)
Copper Pad
PE-WLCSP-4-P2-0610
NNSSMMDD
Substrate
SSMD _{(Unit : mm)}
NSMD and SMD Pad Definition
Pad definition
NSMD (Non-Solder Mask defined)
SMD (Solder Mask defined)
Copper Pad
0.20mm
Min. 0.30mm
Solder Mask Opening
Min. 0.30mm
0.20mm
* Pad layout and size can be modified by customers material, equipment, method.
* Please adjust pad layout according to your conditions.
* Recommended Stencil Aperture Size....ø0.3mm
* Since lead free WL-CSP components are not compatible with the tin/lead solder process, you shall not mount lead free WL-CSP
components using the tin/lead solder paste.