R1183Z Datasheet, PDF (24/26 Pages) RICOH electronics devices division – 150mA LDO REGULATOR

PACKAGE INFORMATION
PE-WLCSP-4-P2-0610
POWER DISSIPATION (WLCSP-4-P2)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
−
Measurement Result
Power Dissipation
Thermal Resistance
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
530mW
θja=(125−25°C)/0.53W=189°C/W
600
530
500
400
300
200
100
0
0
On Board
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area (Unit : mm)