RFPA2172 Datasheet, PDF (9/10 Pages) RF Micro Devices – 0dB to 28dB Variable Gain

RFPA2172
RFMD + TriQuint = Qorvo
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown
for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance
around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to
create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
Figure 2. PCB Solder Mask (Top View)
Thermal Pad and Via Design
The PCB metal land pattern has been designed with a thermal pad that matches the die paddle size on the
bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern
has been designed to address thermal, power dissipation and electrical requirements of the device as well as
accommodating routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished
hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
Revision DS20150609
© 2015 RF Micro Devices, Inc.
9 of 10
Disclaimer: Subject to change without notice
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