RFPA2172 Datasheet, PDF (10/10 Pages) RF Micro Devices – 0dB to 28dB Variable Gain

RFPA2172
RFMD + TriQuint = Qorvo
Pin Names and Descriptions
Pin
Name
Description
Interface Schematic
1
GND
Ground connection. For best performance, keep traces
physically short and connect immediately to the ground plane.
2
GND
Ground connection for the driver stage. For best performance,
keep traces physically short and connect immediately to the
ground plane.
RF IN
RF input. This is a 50Ω input. No external matching is
See pin 15
3
needed. An external DC blocking capacitor is required if this
port is connected to a DC path to ground or a DC voltage.
4
GND
See pin 1.
5
GND
See pin 1.
VPD
Power down pin. When this pin is OV, the device will be in
power down mode, dissipating minimum DC power. This pin
6
also serves as the VCC supply pin for the bias circuitry. VPD
should be at the supply voltage when the part is not in power
down mode.
7
APC
Analog power control. Output power varies as a function of the
voltage on this pin. See graph. This pin must be driven
APC
through a series resistor with a voltage between OV and VCC.
Series resistor determines dynamic range of power control.
Bias
Network
RF IN
See plot “POUT versus Gain Control versus Gain Control
Resistor”.
1st
Stage
8
9
10
11
12
13
14
15
16
Pkg Base
GND
GND
GND
RF OUT
RF OUT
GND
GND
VCC
GND
GND
See pin 1.
See pin 1.
See pin 1.
RF output. An external matching network is required to
provide the optimum load impedance at this pin.
RF output and power supply for the output stage. Bias voltage
for the output stage is provided through this pin. A shunt cap
resonating with the bond wire inductance at 2xf0 can also be
used at this pin to provide a second harmonic trap.
See pin 1.
See pin 1.
Power supply for driver stage and interstage matching. This
pin forms the shunt inductance needed for proper tuning of
the interstage. Refer to the application schematic for the
proper configuration. Note: Position and value of the
components are important.
See pin 15
See pin 15
VCC
Inductor
Pin 15
Bond
Wire
RF IN
1st Stage
External Cap
GND
RF OUT
RF OUT
2nd Stage
See pin 1.
Ground connection for the output stage. This pad should be
connected to the groundplane by vias directly under the
device. A short path is required to obtain optimum
performance, as well as provide a good thermal path to the
PCB for maximum heat dissipation.
Revision DS20150609
© 2015 RF Micro Devices, Inc.
10 of 10
Disclaimer: Subject to change without notice
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