RFSA2624 Datasheet, PDF (8/9 Pages) RF Micro Devices – SERIAL CONTROLLED DIGITAL STEP ATTENUATOR

RFSA2624
Evaluation Board Schematic
Evaluation Board Bill of Materials (BOM)
Description
Reference Designator
Manufacturer
PCB
CAP, 680pF, 10%, 50V, X7R, 0402
C13, C15, C16, C17
Murata
CAP, 0.1uF, 10%, 10V, X5R, 0402
C11, C12, C19, C20
Taiyo Yuden (USA), Inc.
CAP, 1000pF, 10%, 50V, X7R, 0402
C7
Taiyo Yuden (USA), Inc.
RES, 0 OHM, 0402
R1, R2, R4, R5, R8
Kamaya, Inc
DNI
C1-C6, C8, C9, C14, C18, R3, R6-7
CONN, SMA, END LNCH, UNIV, HYB MNT, FLT J1, J2, J99, J100
Heilind Electronics
CONN, HDR, ST, PLRZD, 9-PIN
P1
ITW Pancon
RFSA2624SB
U1
RFMD
Manufacturer's P/N
RFSA26X4410(B)
GRM155R71H681KA01E
RM LMK105BJ104KV
RM UMK105BJ102KV-F
RMC1/16SJPTH
PER MAT-21-1038
MPSS100-9-C
RFSA2624
NOTE: Parts with * following the Reference Designator should not be populated on PCBA. RFMD devices (DUT) may require baking per IPC/JEDEC J-STD-020 for a mini-
mum of 24 hours at 125 +5/-0 °C. Assembly must take place within 12 hours of bake completion. Manufacturers' P/Ns are subject to change by the manufacturers fol-
lowing the issue of this document and are thereby included for reference only. Contact RFMD Corporate Engineering Materials with questions regarding specific
Manufacturers' P/Ns. Shaded lines indicate approved alternate components.
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DS110408