RF5184 Datasheet, PDF (8/8 Pages) RF Micro Devices – DUAL-BAND 800MHz/1900MHz W-CDMA POWER AMPLIFIER MODULE

RF5184
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 2.60 (mm) Sq.
2.50 Typ.
0.50 Typ.
Pin 24
Dimensions in mm.
Pin 1
BBBBBB
Pin 18
A
A
0.50 Typ.
A
A
1.25
A
A
C
A
A
2.50 Typ.
A
A
0.55 Typ.
A
A
BBBBBB
Pin 12
0.55 Typ.
1.25
Figure 2. PCB Solder Mask (Top View)
2-696
Rev A0 060323