English
Language : 

RF5184 Datasheet, PDF (5/8 Pages) RF Micro Devices – DUAL-BAND 800MHz/1900MHz W-CDMA POWER AMPLIFIER MODULE
RF5184
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Pkg
Base
Function Description
VREG_PCS
RFIN_PCS
Regulated voltage supply for PCS band amplifier bias circuit. In power
down mode, both VREG_PCS and VMODE_PCS need to be LOW (<0.5V).
PCS band RF input internally matched to 50Ω. This input is internally
AC-coupled.
VREG_Cell
VMODE_
Cell
Regulated voltage supply for Cell band amplifier bias circuit. In power
down mode, both VREG_Cell and VMODE_Cell need to be LOW (<0.5V).
Cell band mode control pin. For nominal operation (High Power mode),
VMODE_Cell is set LOW. When set HIGH, devices are biased lower to
improve efficiency.
RFIN_Cell Cell band RF input internally matched to 50Ω. This input is internally
AC-coupled.
VCC1_Cell Cell band first stage collector supply. A 2200uF and a 4.7μF decou-
pling capacitors are required.
NC
No connection. Do not connect this pin to any external circuit.
NC
No connection. Do not connect this pin to any external circuit.
VCC2_Cell Cell band output stage collector supply. Please see the schematic for
required external components.
VCC2_Cell Same as Pin 9.
VCC2_Cell Same as Pin 9.
NC
No connection. Do not connect this pin to any external circuit.
NC
No connection. Do not connect this pin to any external circuit.
RFOUT_Cell Cell band RF output. Internally AC-coupled.
NC
No connection. Do not connect this pin to any external circuit.
RFOUT_ PCS band RF output. Internally AC-coupled.
PCS
NC
No connection. Do not connect this pin to any external circuit.
NC
No connection. Do not connect this pin to any external circuit.
VCC2_PCS PCS band output stage collector supply. Please see the schematic for
required external components.
VCC2_PCS Same as Pin 19.
VCC2_PCS Same as Pin 19.
VCC1_PCS PCS band first stage collector supply. A 4.7μF decoupling capacitor is
required.
VCC BIAS Bias circuit supply voltage.
VMODE_
PCS
PCS band mode control pin. For nominal operation (High Power mode),
VMODE_PCS is set Low. When set HIGH, devices are biased lower to
improve efficiency.
GND
The backside of the package should be soldered to a top side ground
pad which is connected to the ground plane with multiple vias. The pad
should have a short thermal path to the ground plane.
Interface Schematic
Rev A0 060323
2-693