RFHA1101D Datasheet, PDF (7/8 Pages) RF Micro Devices – Advanced GaN HEMT Technology

Assembly Notes
Die Storage
 Individual bare die should be held in appropriately sized ESD waffle trays or ESD GEL packs.
 Die should be stored in CDA/N2 cabinets and in a controlled temperature and humidity environment.
Die Handling
 Die should only be picked using an automated or semi-automated pick system and an appropriate pick tool.
 Pick parameters will need to be carefully defined so as not to cause damage to either the top or bottom die surface.
 GaN HEMT devices are ESD sensitive materials. Please use proper ESD precautions when handling devices or
evaluation boards.
 RFMD does not recommend operating this device with typical drain voltage applied and the gate pinched off in a high
humidity, high temperature environment.
Caution: The use of inappropriate or worn-out ejector needle and improper ejection parameter settings can cause die backside
tool marks or micro-cracks that can eventually lead to die cracking.
Die Attach
There are two commonly applied die attach processes: adhesive die attach and eutectic die attach. Both processes use special
equipment and tooling to mount the die.
EUTECTIC ATTACH
 80/20 AµSn preform, 0.5mil to 1mil thickness, made from virgin melt gold.
 Pulsed heat or die scrub attach process using automated or semi-automatic equipment.
 Attach process carried out in an inert atmosphere.
 Custom die pick collets are required that match the outline of the die and the specific process employed using either
pulsed, fixed heat, or scrub.
 Maximum temperature during die attach should be no greater than 320°C and for less than 30 seconds.
 Key parameters that need to be considered include: die placement force, die scrub profile and heat profile.
 Minimal amount of voiding is desired to ensure maximum heat transfer to the carrier and no voids should be present
under the active area of the die.
 Voiding can be measured using X-ray or Acoustic microscopy.
 The acceptable level of voiding should be determined using thermal modeling analysis.
ADHESIVE ATTACH
 High thermal silver filled epoxy is dispensed in a controlled manner and die is placed using an appropriate collet.
Assembled parts are cured at temperatures between 150°C and 180°C.
 Always refer to epoxy manufacturer's data sheet.
 Industry recognized standards for epoxy die attach are clearly defined within MIL-883.
Early Life Screen Conditions
RFMD recommends an Early Life Screen test that subjects this die to T_J = 250°C (junction temperature) for at least 1 hour prior to
field deployment.
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [e-mail].
DS131025
RF MICRO DEVICES^® and RFMD^® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names,
trademarks, and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
7 of 8