RF5198 Datasheet, PDF (7/8 Pages) RF Micro Devices – 3V 1950MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE

RF5198
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.78 x 0.64 (mm)
D = 0.64 x 1.28 (mm)
E = 1.50 (mm) Sq.
Dimensions in mm.
1.50 Typ.
0.75 Typ.
Pin 16
BCB
Pin 1 _A
0.50 Typ.
A
D
E
A
0.55 Typ.
A
A
BBBB
0.55 Typ.
Pin 8
0.75 Typ.
0.75 _{1.00 Typ.}
Typ.
Figure 1. PCB Metal Land Pattern (Top View)
Rev A5 060310
2-7