RFCM5304 Datasheet, PDF (4/7 Pages) RF Micro Devices – INTEGRATED AMPLIFIER

RFCM5304
Evaluation Board Assembly Drawing
Note:
The ground plane of the RFCM5304 module should be soldered onto a board equipped with as many thermal vias as possible.
Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC
power. In any case the module backside temperature should not exceed 100°C.
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
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The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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