RFCM3080 Datasheet, PDF (4/6 Pages) RF Micro Devices – 40-1003MHZ GAAS/GAN PUSH PULL MODULE

RFCM3080
40-1003MHZ GAAS/GAN PUSH PULL MODULE
V+
C1
D1
4n7
TGL34-33A
GND
R1
10kΩ
D2
MM3Z5V6T1
Application Circuit
FB1
Bead 60Ω
RF IN
R7
C9 _0Ω
DNI
R8
0Ω
R9
0Ω
C2
R4
4.7nF
10Ω
T1
RFXF0006
C10
D3
DNI
TQP200002
1
9
C3
0.5pF
2
8
U1
7
R5
RFCM3080
3
6
4
5
C6
0.5pF
T2
RFXF0008
C13
DNI
T3
RFXF0007
C7
4.7nF
R10
C11
0Ω
0.5pF
C14
C8
R11
DNI
4.7nF
0Ω
R12
0Ω
RF OUT
C12
DNI
Evaluation Board Layout
Note:
The ground plane of the RFCM3080 module should be soldered onto a board equipped with as many thermal vias as possible. Underneath this
thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC power (up to 6.5 Watts).
In any case the module backside temperature should not exceed 100°C.
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