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RF5163 Datasheet, PDF (3/12 Pages) RF Micro Devices – 3V-5V, 2.5GHZ LINEAR POWER AMPLIFIER
RF5163
Pin Function Description
Interface Schematic
1
RF IN
RF input. Matching network with DC-block required; see evaluation
See pin 14.
board schematic for details.
2
VREG1 First stage bias circuit ground. Keep PCB traces short and connect
GND
immediately to ground plane.
3
P DOWN Power down pin. Apply <0.6VDC to power up both VCC and VCC1. Apply
2.5VDC to 3.5VDC to power down. If function is not desired pin may be
grounded.
4
P DETECT The P_DOWN and P_DETECT pins can be used in conjunction with an
external feedback path to provide an RF power control function for the
RF5163. The power control function is based on sampling the RF drive
to the final stage of the RF5163. If function is not desired, pin may be
left unterminated.
5
VREG1 First stage bias input - requires regulated voltage to maintain desired
ICC.
6
VREG2 Second stage bias input - requires regulated voltage to maintain
desired ICC. May be tied to pin 5 input after series resistors.
7
VREG2 Second stage bias circuit ground. Ground with a 10nH inductor.
GND
8
NC
No connect (N/C).
9
GND
Ground connection. For best performance, keep PCB trace lengths
short.
10
RF OUT Same as pin 11.
11
RF OUT RF output and bias for the output stage. The power supply for the out-
put transistor needs to be supplied to this pin. This can be done
through a quarter-wave (λ/4) microstrip line that is RF grounded at the
other end, or through an RF inductor that supports the required DC cur-
rent.
RF OUT
12
RF OUT Same as pin 11.
13
GND
Same as pin 8.
14
VCC1
Power supply pin for first stage. External low frequency bypass capaci-
tors should be connected if no other low frequency decoupling is
employed.
VCC
RF IN
15
16
Pkg
Base
VCC1
VCC
GND
BIAS
Same as pin 14.
Power supply pin for bias circuits. External low frequency bypass
capacitors should be connected if no other low frequency decoupling is
employed.
Ground connection. The back side of the package should be connected
to the ground plane through as short a connection as possible, e.g.,
PCB vias under the device are recommended.
See pins 1 and 2.
Rev A12 061114
2-629