RF7115 Datasheet, PDF (22/22 Pages) RF Micro Devices – QUAD-BAND GSM850/GSM900/DCS/PCS TRANSMIT MODULE

RF7115
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern
shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to
accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful
process development is recommended.
PCB Metal Land and Solder Mask Pattern
A = 0.50 Sq. Typ.
Dimensions in mm.
A = 0.65 Sq. Typ.
B = 2.65 x 2.62
C = 2.05 x 2.25
D = 2.05 x 2.62
E = 2.05 x 2.12
6.40
5.60
4.80
4.00
3.20 Typ.
2.40 Typ.
1.60 Typ.
0.80 Typ.
0.42
0.00
A
A
A
A
A
A
A
A
A
AA
7.45 Typ.
7.20 Typ.
A
AA
6.81
6.73
6.40 Typ.
A
5.60 Typ.
A
4.80 Typ.
A
3.75
A
4.00 Typ.
A
B
3.20 Typ.
A
A
2.40 Typ.
A
A
A
0.25
1.60 Typ.
0.80 Typ.
0.49
0.00
A
A
AA
A
7.40 Typ.
C
A
6.27
A
5.15 Typ.
A
A
D
3.53 Typ.
A
A
1.92 Typ.
A
E
A
0.86
A
Metal Land Pattern
Solder Mask Pattern
11-386
Rev A0 060808