RFPA2545 Datasheet, PDF (16/19 Pages) RF Micro Devices – Broadband 4W GaAs HBT Power Amplifier 1400MHz to 2700MHz

RFPA2545
Evaluation Board Bill of Materials (BOM) 2590MHz to 2690MHz Application Circuit
Description
Reference Designator
Manufacturer
Manufacturer's P/N
RFPA2545 Evaluation Board
RFPA2545-412(A)
RFPA2545
U1
RFMD
RFPA2545
CAP, 3.3pF, ±0.1pF, 50V, HI-Q, 0402
C5
Murata Electronics
GJM1555C1H3R3BB01D
CAP, 4.3pF, ±0.1pF, 50V, HI-Q, 0402
C6
Murata Electronics
GJM1555C1H4R3BB01D
CAP, 1µF, 10%, 16V, X7R, 0805
CAP, 1000pF, 10%, 50V, X7R, 0402
C7
C8, C14
Murata Electronics
Murata Electronics
GRM21BR71C105KA01K
GRM155R71H102KA01D
CAP, 15pF, 5%, 50V, C0G, 0402
C9, C15
Murata Electronics
GRM1555C1H150JA01D
CAP, 10µF, 10%, 25V, X7R, 1206
C12
Taiyo Yuden (USA), Inc.
TMK316AB7106KL-T
CAP, 3.6pF, ±0.1pF, 50V, HI-Q, 0402
C16
Murata Electronics
GJM1555C1H3R6BB01D
CAP, 10pF, 1%, 50V, HI-Q, 0402
C22
Murata Electronics
GJM1555C1H100FB01D
CAP, 100pF, 5%, 50V, C0G, 0402
C23
Murata Electronics
GRM1555C1H101JA01D
IND, 3.9nH, 5%, WW, 0603
L1
Coilcraft, Inc.
0603HC-3N9XJLW
IND, 1.2nH, 5%, W/W, 0402
L2
Coilcraft, Inc.
0402CS-1N2XJLW
RES, 1K, 5%, 1/16W, 0402
RES, 0Ω, 0402
CONN, SMA, END LNCH, RND PIN,
0.039"
R1
R2
J1-J2
Kamaya, Inc.
Kamaya, Inc.
GIGALANE CO., LTD.
RMC1/16S-102JTH
RMC1/16SJPTH
PSF-S01-002
CONN, HDR, ST, PLRZD, 5-PIN, 0.100"
P1
HEATSINK BLOCK, 1.16 SQ I
ITW Pancon
Robert S. Wells
MPSS100-5-C
EEF-102059
SCREW, 2-56 x 3/16", SOCKET HEAD
S1-S5
McMaster-Carr Supply Co.
92196A076
DNP
C1-C4, C10-C11, C13,
C17-C21
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
DS150130
For sales or technical support, contact RFMD at +1.336.678.5570 or [e-mail].
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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