RF5111_15 Datasheet, PDF (14/14 Pages) RF Micro Devices – DCS POWER AMPLIFIER

RF5111
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 1.60 (mm) Sq.
Dimensions in mm.
1.50 Typ.
0.50 Typ.
Pin 16
B
Pin 1
A
0.50 Typ.
A
A
0.55 Typ.
A
B
0.55 Typ.
BB
C
BB
S B
Pin 12
A
N _A
0.75 Typ.
1.50
IG A
Typ.
S ^A
E ^B
D ^{Pin 8}
Figure 2. PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design
NEW ^{0.75 Typ.}
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
R Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
FO ^strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
NOT ^{quantity of vias be increased by a 4:1 ratio to achieve similar results.}
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Rev A1 DS150909