RFPA5026 Datasheet, PDF (13/16 Pages) RF Micro Devices – 4.9GHz TO 5.9GHz 2W InGaP AMPLIFIER

RFPA5026
Evaluation Board Layout and Bill of Materials
5.15GHz to 5.35GHz Evaluation Board Layout for V+= V_CC=V_PC=5.0V, I_Q=563mA
PCB Notes: Do not use less than the recommended number of via holes under the device ground paddle. RF layers thicker
than 0.020 inches )0.5mm) not recommended.
Bill of Materials
DESG
Q1
R1
R2
R3
R4
C1
C2
C3, 4
C5
C6
C7
L1
Description
RFPA5026
750 , 0603 1%
0 , 0603
2.80K , 0603 1%
47K , 0603
1uF 16V MLCC CAP
1.8pF CAP, 0603
0.1uF CAP, 0603
4.7pF CAP, 0603
0.7pF CAP, 0603
5.6pF CAP, 0603
5.6nH IND, 0805
Notes
DFN
0402 may be used.
0402 may be used.
0402 may be used.
0402 may be used.
Tantulum ok for EVM performance.
Use MLCC type for best IM3 levels.
NPO, ROHM MCH185A1R8DK or equiv.
X7R 0402 ok, ROHM MCH182CN104K or equiv.
NPO, low ESR, ATC 600S4R7CW250 or equiv.
NPO, low ESR, ATC 600S0R7CW250 or equiv.
NPO, low ESR, ATC 600S5R6CW250 or equiv.
Coilcraft 0805-HQ-5N6XJBB
DS121114
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
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