RF5110_1 Datasheet, PDF (12/14 Pages) RF Micro Devices – 3V GSM POWER AMPLIFIER

RF5110
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 1.50 (mm) Sq.
Dimensions in
mm.
1.50 Typ.
0.50 Typ.
Pin 16
Pin 1
A
0.50 Typ.
A
A
BBBB
C
Pin 12
A
A
0.75 Typ.
1.50
A
Typ.
A
0.55 Typ.
0.55 Typ.
A
BBBB
Pin 8
0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
12 of 14
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
Rev A0 DS050318