RF5189_06 Datasheet, PDF (10/10 Pages) RF Micro Devices – 3V, 2.45GHz LINEAR POWER AMPLIFIER

RF5189
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB Metal Land Pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance
can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.79 x 0.38 (mm) Typ.
B = 0.38 x 0.79 (mm) Typ.
C = 1.55 (mm) Sq.
1.00 Typ.
Pin 12
Dimensions in mm.
BBB
Pin 1
A
0.50 Typ.
A
A
0.78 Typ.
0.78 Typ.
Figure 2. PCB Solder Mask Pattern (Top View)
Pin 9
A
C
A _{1.00 Typ.}
A
BBB
Pin 6
0.50 Typ.
Thermal Pad and Via Design
The PCB Metal Land Pattern has been designed with a thermal pad that matches the exposed die paddle size on the
bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
2-664
Rev A7 060127