HR5459-25B Datasheet, PDF (4/6 Pages) RFHIC – GaN Hybrid Power Amplifier

GaN Hybrid Power Amplifier HR5459-25B
Package Dimensions (Type: NP-36)
* Unit: mm[inch] | Tolerance: ±0.15[.006]
▲ Top View
Pin No
1
2
3
▲ Side View
Function
Vds1
RF input
Vgs1
Pin No
6
5
4
▲ Bottom View
Function
Vds2
RF output
Vgs2
Recommended Pattern
* Mounting Configuration Notes
1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.
2. To properly use heatsink, ensure the ground/thermal via hole region to contact the heatsink. We recommend the mounting screws
be added near the heatsink to mount the board
3. In designing the necessary RF trace, width will depend upon the PCB material and construction.
4. Use 1 oz. Copper minimum thickness for the heatsink.
5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink
6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Korean Facilities : 82-31-250-5078 / [e-mail]
US Facility : 919-677-8780 / [e-mail]
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All specifications may change without notice
Version 1.0