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| MO9Q_14 Datasheet, PDF (3/4 Pages) RFHIC – Integrated Monolithic GaAs MESFET | |||
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Active Down Mixer
MO9Q
Package Dimensions (Type: QFN3x3)
* Unit: mm[inch] | Tolerance: ±0.2[.008]
â² Top View
â² Side View
â² Bottom View
Pin Description
Pin No Function Pin No Function Pin No Function Pin No Function
1
RFN In
5
CUR
9
NC
13
Ground
2
NC
6
Ground
10
Lo_In
14
IF Out
3
RF In
7
Ground
11
NC
15
NC
4
NC
8
Bias
12
NC
16
IFN Out
* Mounting Configuration Notes
1. Ground / thermal via holes are critical for the proper performance of this device.
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink.
4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink.
5. RF trace width depends upon the PCB material and construction.
6. Use 1 oz. Copper minimum.
Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com
US Facility : 919-677-8780 / sales@rfhicusa.com
3/4
All specifications may change without notice
Version 8.2
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