NP82N04MUG Datasheet, PDF (9/10 Pages) Renesas Technology Corp – MOS FIELD EFFECT TRANSISTOR

MARKING INFORMATION
NEC
82N04
UG
NP82N04MUG, NP82N04NUG
Pb-free plating marking
Abbreviation of part number
Lot code
RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Soldering Conditions
Wave soldering
NP82N04MUG,
NP82N04NUG
Maximum temperature (Solder temperature): 260°C or below
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Partial heating
NP82N04MUG,
NP82N04NUG
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Recommended
Condition Symbol
THDWS
P350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D19803EJ1V0DS
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