HD151TS302ARP Datasheet, PDF (8/12 Pages) Renesas Technology Corp – Spread Spectrum Clock for EMI Solution

HD151TS302ARP
Application Information
1. Recommended Circuit Configuration
The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2.
VDD decoupling is important to both reduce Jitter and EMI radiation.
The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased
trace inductance will negate its decoupling capability.
The C2 decoupling capacitor shown should be a tantalum type.
SSCCLKOUT
R1
1
8 SEL1
VDD
C2 C1
GND GND
2
3
TS300 Series
4
GND
R2
7
6 SEL0
5
Notes:
XIN
(Crystal or
Reference input)
C1 = High frequency supply decoupling capacitor.
(0.1 µF recommended)
C2 = Low frequency supply decoupling capacitor.
(22 µF tantalum type recommended)
R1, R2 = Match value to line impedance.
(22 Ω Reference value)
XOUT
(Crystal or
Not connection)
Figure 2 Recommended circuit configuration
CLKOUT
Rev.5.00, May.19.2003, page 8 of 12