HAT2088R_15 Datasheet, PDF (5/9 Pages) Renesas Technology Corp – Silicon N Channel MOS FET Silicon N Channel MOS FET

HAT2088R
Main Characteristics
Power vs. Temperature Derating
4
Test Condition:
When using the glass epoxy board
(FR4 40 × 40 × 1.6 mm), PW ≤ 10 s
3
2
1
0
0
50
100
150
200
Ambient Temperature Ta (°C)
Typical Output Characteristics
10
10 V
8V
8
6
6.5 V
Pulse Test
6V
4
5.5 V
2
V_GS = 5 V
0
0
4
8
12 16 20
Drain to Source Voltage V_DS (V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
10
Pulse Test
8
6
4
I_D = 8 A
2
5A
2A
0
0
4
8
12 16
20
Gate to Source Voltage V_GS (V)
Rev.2.00 Sep 07, 2005 page 3 of 6
Maximum Safe Operation Area
100
10 µs
10
1
0.1
0.01
PW
DC
Operation
Oinperation
this area is
limited by R_{DS (on)}
= ₁₀
(PW
≤
100
1 _ms
ms
1^N₀^o_s^te₎4
µ_s
Ta = 25°C
1 shot Pulse
0.001
0.1 0.3 1 3 10 30 100 300 1000
Drain to Source Voltage V_DS (V)
Note 4:
When using the glass epoxy board
(FR4 40 × 40 × 1.6 mm)
Typical Transfer Characteristics
10
V_DS = 10 V
Pulse Test
8
6
4
Tc = 75°C
2
25°C
–25°C
0
0
2
4
6
8
10
Gate to Source Voltage V_GS (V)
Static Drain to Source on State Resistance
vs. Drain Current
5
Pulse Test
V_GS = 10 V, 15 V
2
1
0.5
0.2
0.1
0.1 0.2 0.5 1 2 5 10 20 50
Drain Current I_D (A)