PD703223_15 Datasheet, PDF (37/41 Pages) Renesas Technology Corp – V850ES/GB1TM VENUS 32-/16-bit Single-Chip Microcontroller with CAN Interface

µPD703223, µPD703224, µPD703225, µPD703226
4. Recommended Soldering Conditions
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor
Device:
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended please consult NEC.
Soldering Method
Infrared reflow
VPS
Partial heating
Table 4-1: Soldering Conditions
Soldering Condition
Package peak temperature: 235°C,
Time: 30 seconds max. (210°C min.),
Number of times: 3 max.,
Number of days: 7 ^Note
Package peak temperature: 215°C,
Time: 30 seconds max. (210°C min.),
Number of times: 2 max.,
Number of days: 7 ^Note
Pin temperature: 300°C max.,
Time: 3 seconds max. (per side of device)
Symbol of Recommended Soldering
Condition
IR35-107-3
VP15-207-2
-
Note: The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been
opened.
After that, prebaking is necessary at 125 °C for 10 to 72 hours.
Caution: Do not use two or more soldering methods in combination (except partial heating
method).
DATA SHEET U15870EE1V1DS00
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