PD17P246_15 Datasheet, PDF (28/34 Pages) Renesas Technology Corp – PD17P246_15 FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROLLER

µPD17P246
6. RECOMMENDED SOLDERING CONDITIONS
The µPD17P246 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 6-1. Surface Mounting Type Soldering Conditions
µPD17P246M1MC-5A4: 30-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max.
(at 210°C or higher), Count: Two times or less, Exposure limit: 3 days^Note
(after that, prebake at 125°C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max.
(at 200°C or higher), Count: Two times or less, Exposure limit: 3 days^Note
(after that, prebake at 125°C for 10 hours)
VP15-103-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, WS60-103-1
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 3 days^Note (after that, prebake at 125°C for 10 hours)
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry peak, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet U15215EJ1V0DS