PD8827B_15 Datasheet, PDF (22/26 Pages) Renesas Technology Corp – 7500 PIXELS × 3 COLOR CCD LINEAR IMAGE SENSOR

μ PD8827B
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
Type of Through-hole Device
μ PD8827BCZ-A: CCD linear image sensor 40-pin plastic DIP with heat sink (15.24 mm (600))
Process
Partial heating method
Conditions
Pin temperature: 380°C or below, Heat time: 3 seconds or less (per pin).
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.
The optical characteristics could be degraded by such contact.
2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap
soiling and heat resistance. So the method cannot be guaranteed.
NOTES OF HANDLING THE PACKAGES
The application of an excessive load to the package may cause the package to warp or break, or cause chips to
come off internally. Particular care should be taken when mounting the package on the circuit board. You should not
reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB.
For this product, the reference value for the three-point bending strength Note is 280[N]. Avoid imposing a load,
however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body.
Note Three-point bending strength test
Distance between supports: 70 mm, Support R: R2 mm, Loading rate: 0.5 mm/min.
Load
Load
70 mm
70 mm
20
Data Sheet S20022EJ1V1DS