HA13173H Datasheet, PDF (20/24 Pages) Renesas Technology Corp – Multiple Voltage Regulator for Car Audio

HA13173H
Handling Cautions (SP-15TGV Package)
Mounting
1. For mounting the package on the heat sink, 4 to 8 kg⋅cm of screwing-torque is recommended; excessive torque will
cause device deformation, resulting in pellet-crack, connector-lead-wire-breaking, etc., and too less torque will
increase the heat resistance.
2. The use of screws needs the following cautions.
1) Use the standardized binding-head screws.
2) Ova counter-sunk screws, subjecting the IC to intense stress, must not be used.
3) To the use of tapping screws the cautions for binding torque strength must be applied.
4) Use a tapping screw diameter smaller than an IC mounting-hole.
Binding-head screw
Recommended Screw
Small-head screw
Flat-head screw
Unused Screws
Oval counter-sunk screws
3. In IC binding, metal-fittings striking on the plastic of the IC may cause characteristics-deterioration or package-
crack.
4. Poor flatness of heat sink sometimes prevents effective heat-sinking or subjects the IC surface to intense stress,
causing characteristics-deterioration or package-crack.
1) 0.1 mm max. of heat-sink flatness error for the contact area (14.3 mm × 19.66 mm) will be tolerated.
2) Contact-surface ruggedness should be finished in ∇∇ grade.
3) For aluminum, copper, or iron plates, check them for no burr and mold them for screw-holes.
4) Cutting chips between the IC header and the heat sink will cause heat-sinking deterioration.
5) The heat-sink hole diameter should not exceed 4.0 mm.
5. As silicone grease, the Shin-Etsu Chemical Industry G746 is recommended. Coarse or an excessive amount of
grease may cause intensive stress to the IC, when binding.
6. Do not Screw the IC on the heat sink after soldering the lead wires on the printed circuit board (PCB). If the IC is
screwed after the lead wires are soldered on the PCB then characteristics of the IC may deteriorate in the cause of
large strain concentrate to the lead wires because of dimension-difference of the PCB and the heat sink.
7. Do not solder of lead wires to the header of the IC on direct. If you solder direct then the IC life characteristics will
deteriorate remarkably with bad-influence on the die.
For the method and conditions of lead-wire forming, users are requested to contact the vendor.
Rev.1.00 Jan 16, 2007 page 20 of 23