M16C29_07 Datasheet, PDF (2/17 Pages) Renesas Technology Corp – Standard Characteristics

M16C/29 Group Standard Characteristics
M30290FxHP(x=A,C),M30291FxHP(x=A,C),
M30290FxTHP(x=A,C),M30291FxTHP(x=A,C),
M30290FxVHP(x=A,C),M30291FxVHP(x=A,C)
f(Xcin)=32kHz in low-power consumption mode, Program running on RAM
(Main clock oscillation stop, Ta = 25 °C, output transistor is in the cut-off state.)
25
20
15
Clock source
f(Xcin) = Crystal oscillator
Frequency: 32.768kHz
Load capacitance:12.5pF
No Peripheral functions.
Xcin-Xcout drive capacity : Low
Flash memory stop.
10
5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Fig. 4. Vcc-Icc (low-speed mode)
Power Source Voltage Vcc [V]
f(Xcin)=32kHz in low-power consumption mode, Program running on flash memory
(Main clock oscillation stop, Ta = 25 °C, output transistor is in the cut-off state.)
1000
800
600
XCIN XCOUT
Rf
Rf: Open
Rd _{Rd: 0 Ω}
C1: 15pF
C1
C2 ^{C2: 15pF}
Clock source
f(Xcin) = Crystal oscillator
Frequency: 32.768kHz
Load capacitance:12.5pF
No Peripheral functions.
Xcin-Xcout drive capacity : Low
400
200
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Fig. 5. Vcc-Icc (low-speed mode)
Power Source Voltage Vcc [V]
XCIN XCOUT
Rf
Rf: Open
Rd _{Rd: 0 Ω}
C1: 15pF
C1
C2 ^{C2: 15pF}
On-chip oscillator operating, f2(ROC) selected, f(BCLK)=1MHz (external oscillation stop, output transistor is in the cut-off state.* )
A/D conversion not executed
Clock source
3.0
On-chip oscillator
Select f2(ROC)
2.5
2.0
Division setting
ROC Main Timer
SI/O3
Program running
Divider Clock A, B Timer S SI/O4 MMIIC
1.5
on Flash memory
1/2 1/1 ｆ1 f1 f1 (fiic/2)/31
Program running
* Timer pulse and serial data is output
on RAM
1.0
Program running
on RAM
0.5
Flash memory OFF
0.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Power Source Voltage Vcc [V]
Fig. 6. Vcc-Icc (On-chip oscillator operating)
REJ99B1342-0100
©2007. Renesas Technology Corp., All rights reserved.
2007.06
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