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2SK1151_11 Datasheet, PDF (2/7 Pages) Renesas Technology Corp – Silicon N Channel MOS FET | |||
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2SK1151(L), 2SK1151(S), 2SK1152(L), 2SK1152(S)
Preliminary
Electrical Characteristics
(Ta = 25°C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown 2SK1151 V(BR)DSS 450
â
â
V ID = 10 mA, VGS = 0
voltage
2SK1152
500
Gate to source breakdown voltage
V(BR)GSS
±30
â
â
Gate to source leak current
IGSS
â
â
±10
Zero gate voltage drain 2SK1151
IDSS
â
current
2SK1152
â
100
Gate to source cutoff voltage
VGS(off)
2.0
â
3.0
Static drain to source on 2SK1151 RDS(on)
â
state resistance
2SK1152
â
3.5
5.5
4.0
6.0
Forward transfer admittance
|yfs|
0.6
1.1
â
Input capacitance
Ciss
â
160
â
Output capacitance
Coss
â
45
â
V IG = ±100 μA, VDS = 0
μA VGS = ±25 V, VDS = 0
μA VDS = 360 V, VGS = 0
VDS = 400 V, VGS = 0
V ID = 1 mA, VDS = 10 V
Ω ID = 1 A, VGS = 10 V *3
S
ID = 1 A, VDS = 20 V *3
pF VDS = 10 V, VGS = 0,
pF f = 1 MHz
Reverse transfer capacitance
Crss
â
5
â
pF
Turn-on delay time
td(on)
â
5
â
Rise time
tr
â
10
â
Turn-off delay time
td(off)
â
20
â
Fall time
tf
â
10
â
Body to drain diode forward voltage
VDF
â
1.0
â
Body to drain diode reverse recovery
trr
â
220
â
time
Note: 3. Pulse test
ns ID = 1 A, VGS = 10 V,
ns RL = 30 Ω
ns
ns
V IF = 1.5 A, VGS = 0
ns IF = 1.5 A, VGS = 0,
diF/dt = 100 A/μs
R07DS0397EJ0300 Rev.3.00
May 16, 2011
Page 2 of 6
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