PD16805_15 Datasheet, PDF (13/18 Pages) Renesas Technology Corp – MONOLITHIC H BRIDGE DRIVER CIRCUIT

µPD16805
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this under the conditions described below.
For soldering methods and conditions other than those listed below, consult NEC.
For details of the recommended soldering conditions, refer to information document “Semiconductor Device
Mounting Technology Manual”.
µPD16805GS
Soldering Method
Soldering Conditions
Infrared reflow
Peak package temperature: 235°C, Time: 30 seconds MAX. (210°C MIN.),
Number of times: 2 MAX.
VPS
Peak package temperature: 215°C, Time: 40 seconds MAX. (200°C MIN.),
Number of times: 2 MAX.
The number of storage days at 25°C, 65% RH after the dry pack has been opened
Recommended
Conditions Symbol
IR35-00-2
VP15-00-2
µPD16805MA-6A5
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235°C; Duration: 30 sec. max. (210°C or above):
Number of times: Max. 3; Time limit: None^Note
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is
recommended.
VPS
Package peak temperature: 215°C; Duration: 40 sec. max. (200°C or above):
Number of times:3; Time limit: None^Note
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is
recommended.
Wave soldering
Package peak temperature: 260°C or less, Duration: 10 sec. Max.,.
Preparatory heating temperature: 120°C or less; Number of times: 1
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is
recommended.
Note The number of storage days at 25°C, 65% RH after the dry pack has been opened
Recommended
Conditions Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution Use of more than one soldering method should be avoided.
Data Sheet S11032EJ4V0DS
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